View BA15218F-E2_8743974.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 1/18 10.sep.2013 rev.001 tsz22111 ? 14 ? 001 datashee t operational amplifiers low noise operational amplifier ba15218f general description the ba15218f is low noise operational amplifier with high voltage gain. they have good performance of input referred noise voltage(1.0 vrms), total harmonic distortion (0.0015%) and operating supply voltage(2.0v to 16.0v). these are suitable for audio applications and active filter. features ? high voltage gain ? low input referred noise voltage ? low total harmonic distortion ? wide operating supply voltage applications ? audio application ? consumer equipment ? active filter key specifications ? operating supply voltage (split supply): 2.0v to 16.0v ? slew rate: 3v/s(typ) ? input referred noise voltage: 1.0 vrms(typ) ? total harmonic distortion: 0.0015%(typ) ? temperature range: -40c to +85c packages w(typ) x d(typ) x h(max) sop8 5.00mm x 6.20mm x 1.71mm simplified schematic figure 1. simplified schematic product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays. vcc -in out +in vee downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 2/18 10.sep.2013 rev.001 tsz22111 ? 15 ? 001 ba15218f pin configuration ba15218f : sop8 pin no. pin name 1 out1 2 -in1 3 +in1 4 vee 5 +in2 6 -in2 7 out2 8 vcc package sop8 ba15218f ordering information b a 1 5 2 1 8 f - e2 part number ba15218f package f: sop8 packaging and forming specification e2: embossed tape and reel (sop8) line-up topr operating supply voltage (split supply) supply current (typ) slew rate (typ) package orderable part number -40c to +85c 2.0v to 16.0v 5ma 3v/s sop8 reel of 2500 BA15218F-E2 absolute maximum ratings (t a =25c) parameter symbol rating unit supply voltage vcc-vee +36 v power dissipation p d 0.55 (note 1,2) w differential input voltage (note 3) v id vcc - vee v input common-mode voltage range v icm vee - vcc v input current i i -10 (note 4) ma operating supply voltage v opr 2 to 16 (+4 to +32) v operating temperature t opr -40 to +85 c storage temperature t stg -55 to +125 c output short current (note 5) i omax 50 ma maximum junction temperature t jmax +125 c (note 1) to use at temperature above t a =25 ? c reduce 5.5mw/ ? c. (note 2) mounted on a fr4 glass epoxy pcb 70 mm70mm1.6mm (copper foil area less than 3%). (note 3) the voltage difference between inverting input and non-inverting input is the differential input voltage. then input terminal voltage is set to more than vee. (note 4) an excessive input current will flow when input voltages of less than vee-0.6v are applied. the input current can be set to less than the rated current by adding a limiting resistor. (note 5) this current value is when the output is shorted to vcc or vee. please use within the p d range. caution: operating the ic over the abso lute maximum ratings may damage the ic. the dam age can either be a short circuit betwee n pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as ad ding a fuse, in case the ic is operated over the absolute maximum ratings. + ch2 - + ch1 - + 1 2 3 4 8 7 6 5 out2 vee vcc out1 -in1 +in1 +in2 -in2 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 3/18 10.sep.2013 rev.001 tsz22111 ? 15 ? 001 ba15218f electrical characteristics ba15218f (unless otherwise s pecified vcc=+15v, vee=-15v, t a =25c) parameter symbol limit unit conditions min typ max input offset voltage (note 6) v io - 0.5 5.0 mv r s # 10k ? input offset current (note 6) i io - 5 200 na - input bias current (note 6,7) i b - 50 500 na - large signal voltage gain a v 86 110 - db r l $ 2k ? , out=10v input common-mode voltage range v icm 12 14 - v - common-mode rejection ratio cmrr 70 90 - db r s # 10k ? power supply rejection ratio psrr 76 90 - db r s # 10k ? supply current i cc - 5.0 8.0 ma +in=0v, r l = maximum output voltage v om 12 14 - v r l $ 10k ? 10 13 - v r l $ 2k ? slew rate sr - 3.0 - v/ s a v =0db, r l =2k ? gain bandwidth gbw - 10 - mhz f=10khz input referred noise voltage v n - 1.0 - vrms r s =1k ? f=20hz to 30khz, riaa - 9.5 - hz nv/ r s =100 ? , +in=0v, f=1khz total harmonic distortion + noise thd+n - 0.0015 - % a v =20db r l =2k ? , 80khz-lpf channel separation cs - 120 - db f=1khz, out=0.5vrms (note 6) absolute value (note 7) current direction: since first input stage is composed with pnp transist or, input bias current flows out of ic. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 4/18 10.sep.2013 rev.001 tsz22111 ? 15 ? 001 ba15218f description of electrical characteristics described below are descriptions of the rele vant electrical terms used in this datasheet. items and symbols used are also shown. note that item name and symbol and their meaning ma y differ from those on another manufacturers document or general document. 1. absolute maximum ratings absolute maximum rating items indicate the condition which must not be exceeded. application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cau se deterioration of characteristics. (1) supply voltage (vcc/vee) indicates the maximum voltage that can be applied between the vcc terminal and vee terminal without deterioration or destruction of characteristics of internal circuit. (2) differential input voltage (v id ) indicates the maximum voltage that can be applied betw een non-inverting and inverting terminals without damaging the ic. (3) input common-mode voltage range (v icm ) indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. input common-mode voltage range of the maximum ratin gs does not assure normal operation of ic. for normal operation, use the ic within the input co mmon-mode voltage range characteristics. (4) power dissipation (p d ) indicates the power that can be consumed by the ic when mo unted on a specific board at t he ambient temperature 25c (normal temperature). as for package product, p d is determined by the temperature that can be permitted by the ic in the package (maximum junction temperature) and the thermal resistance of the package. 2. electrical characteristics items (1) input offset voltage (v io ) indicates the voltage difference between non-inverting termi nal and inverting terminals. it can be translated into the input voltage difference required for setting the output voltage at 0 v. (2) input offset current (i io ) indicates the difference of input bias current bet ween the non-inverting and inverting terminals. (3) input bias current (i b ) indicates the current that flows into or out of the input terminal. it is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) large signal voltage gain (a v ) indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. it is normally the amplifying rate (gain) with reference to dc voltage. a v = (output voltage) / (differential input voltage) (5) input common-mode voltage range (v icm ) indicates the input voltage range where ic normally operates. (6) common-mode rejection ratio (cmrr) indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. it is normally the fluctuation of dc. cmrr = (change of input common-mode voltage)/(input offset fluctuation) (7) power supply rejection ratio (psrr) indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. it is normally the fluctuation of dc. psrr= (change of power supply volta ge)/(input offset fluctuation) (8) supply current (i cc ) indicates the current that flows within the ic under specified no-load conditions. (9) maximum output voltage (v om ) signifies the voltage range that can be out put under specific output conditions. (10) slew rate (sr) indicates the ratio of the change in output voltage wi th time when a step input signal is applied. (11) gain band width (gbw) the product of the open-loop voltage gai n and the frequency at which the vo ltage gain decreases 20db/decade. (12) input referred noise voltage (v n ) indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal. (13) total harmonic distortion + noise (thd+n) indicates the fluctuation of input offset voltage or that of output vo ltage with reference to the change of output voltage of driven channel. (14) channel separation (cs) indicates the fluctuation in the output vo ltage of the driven channel with reference to the change of output voltage of the channel which is not driven. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 5/18 10.sep.2013 rev.001 tsz22111 ? 15 ? 001 ba15218f 0 5 10 15 20 25 30 0.1 1 10 load resistance [k ? ] maximum output voltage swing [v p-p ] typical performance curves ba15218f (*)the above characteristics are measurements of typical sample, they are not guaranteed. 25c -40c 85c 2 v 15v 7.5 v 0 2 4 6 8 10 -50 -25 0 25 50 75 100 ambient temperature [c] supply current [ma] figure 4. supply current vs ambient temperature figure 3. supply current vs supply voltage 0 2 4 6 8 10 0 2 4 6 8 10 12 14 16 18 supply voltage [v] supply current [ma] figure 5. maximum output voltage swing vs load resistance (vcc/vee=+15v/-15v, t a =25c) figure 2. power dissipation vs ambient temperature (derating curve) ba15218f 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 ambient temperature [c] . power dissipation [w] downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 6/18 10.sep.2013 rev.001 tsz22111 ? 15 ? 001 ba15218f -20 -15 -10 -5 0 5 10 15 20 0 2 4 6 8 10 12 14 16 18 supply voltage [v] maximum output voltage [v] -20 -15 -10 -5 0 5 10 15 20 - 5 0- 2 5 0 2 55 07 51 0 0 ambient temperature [c] maximum output voltage [v] -20 -15 -10 -5 0 5 10 15 20 0 5 10 15 20 25 output current [ma] maximum output voltage [v] typical performance curves - continued ba15218f (*)the above characteristics are measurements of typical sample, they are not guaranteed. figure 7. maximum output voltage vs supply voltage (r l =2k ? , t a =25c) v oh v ol figure 6. maximum output voltage vs load resistance (vcc/vee=+15v/-15v, t a =25c) v ol v oh -20 -15 -10 -5 0 5 10 15 20 0.1 1 10 load resistance [k ? ] maximum output voltage [v] figure 8. maximum output voltage vs ambient temperature (vcc/vee=+15v/-15v, r l =2k ? ) v oh v ol figure 9. maximum output voltage vs output current (vcc/vee=+15v/-15v, t a =25c) v ol v oh downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 7/18 10.sep.2013 rev.001 tsz22111 ? 15 ? 001 ba15218f typical performance curves - continued ba15218f (*)the above characteristics are measurements of typical sample, they are not guaranteed. -40c 85c 25c -6 -4 -2 0 2 4 6 0 2 4 6 8 10 12 14 16 18 supply voltage [v] input offset voltage [mv] figure 10. input offset voltage vs supply voltage (v icm =0v, e k =0v) figure 11. input offset voltage vs ambient temperature (v icm =0v, e k =0v) 2v 7.5v 15v -6 -4 -2 0 2 4 6 -50 -25 0 25 50 75 100 ambient temperature [c] input offset voltage [mv] figure 12. input bias current vs supply voltage (v icm =0v, e k =0v) -40c 25c 85c 0 10 20 30 40 50 60 0 2 4 6 8 10 12 14 16 supply voltage [v] input bias current [na] figure 13. input bias current vs ambient temperature (v icm =0v, e k =0v) 15v 7.5v 2v 0 10 20 30 40 50 60 -50 -25 0 25 50 75 100 ambient temperature [c] input bias current [na] downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 8/18 10.sep.2013 rev.001 tsz22111 ? 15 ? 001 ba15218f typical performance curves - continued ba15218f (*)the above characteristics are measurements of typical sample, they are not guaranteed. figure 17. common mode rejection ratio vs ambient temperature (vcc/vee=+15v/-15v, v icm =-12v to +12v) 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 ambient temperature [c] common mode rejection ratio [db] 2v 15v 7.5v -30 -20 -10 0 10 20 30 - 5 0- 2 5 0 2 5 5 0 7 51 0 0 ambient temperature [c] input offset current [na] figure 15. input offset current vs ambient temperature (v icm =0v, e k =0v) -40c 25c 85c -30 -20 -10 0 10 20 30 0 2 4 6 8 10 12 14 16 supply voltage [v] input offset current [na] figure 14. input offset current vs supply voltage (v icm =0v, e k =0v) figure 16. input offset voltage vs common mode input voltage (vcc=8v, e k =-4v) 85c 25c -40c -5 -4 -3 -2 -1 0 1 2 3 4 5 02468 common mode input voltage [v] input offset voltage [mv] downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 9/18 10.sep.2013 rev.001 tsz22111 ? 15 ? 001 ba15218f 0 20 40 60 80 1 10 1 00 1 0 00 10 00 0 frequency [hz] input reffered noise voltage [nv/ hz] typical performance curves - continued ba15218f (*)the above characteristics are measurements of typical sample, they are not guaranteed. 20khz 20hz 1khz figure 18. power supply rejection ratio vs ambient temperature (vcc/vee=+2v/-2v to +15v/-15v) 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 ambient temperature [c] power supply rejection ratio [db] figure 19. slew rate vs supply voltage (c l =100pf, r l =2k ? , t a =25c) 0 1 2 3 4 0 2 4 6 8 10 12 14 16 supply voltage [v] slew rate [v/s] figure 20. equivalent input noise voltage vs frequency (vcc/vee=+15v/-15v, r s =100 ? , t a =25c) figure 21. total harmonic distortion vs output voltage (vcc/vee=+15v/-15v, a v =20db, r l =2k ? , 80khz-lpf, t a =25c) 0.0001 0.001 0.01 0.1 1 0.1 1 10 output voltage [vrms] total harmonic distortion [%] 1 10 10 2 10 3 10 4 frequency [hz] downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 10/18 10.sep.2013 rev.001 tsz22111 ? 15 ? 001 ba15218f typical performance curves - continued ba15218f (*)the above characteristics are measurements of typical sample, they are not guaranteed. gain phase figure 23. voltage gain ? phase vs frequency (vcc/vee=+15v/-15v, a v =40db, r l =2k ? , t a =25c) 0 10 20 30 40 50 60 70 80 90 100 1.e+00 1.e+01 1.e+02 1.e+ 03 1.e+ 04 1.e+05 1.e+06 1.e+07 frequency [khz] voltage gain [db] 0 20 40 60 80 100 120 140 160 180 200 phase [deg] figure 22. maximum output voltage swing vs frequency (vcc/vee=+15v/-15v, r l =2k ? , t a =25c) 0 5 10 15 20 25 30 1 10 100 1000 frequency [hz] maximum output voltage swing [v p-p ] 1 10 10 2 10 3 10 4 10 5 10 6 10 7 frequency [hz] downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 11/18 10.sep.2013 rev.001 tsz22111 ? 15 ? 001 ba15218f application information null method condition for test circuit 1 vcc, vee, e k , v icm unit: v parameter v f s1 s2 s3 vcc vee e k v icm calculation input offset voltage v f1 on on off 15 -15 0 0 1 input offset current v f2 off off off 15 -15 0 0 2 input bias current v f3 off on off 15 -15 0 0 3 v f4 on off large signal voltage gain v f5 on on on 15 -15 -10 0 4 v f6 15 -15 10 0 common-mode rejection ratio (input common-mode voltage range) v f7 on on off 3 -27 12 0 5 v f8 27 -3 -12 0 power supply rejection ratio v f9 on on off 2 -2 0 0 6 v f10 15 -15 0 0 - calculation - 1. input offset voltage (v io ) 2. input offset current (i io ) 3. input bias current (i b ) 4. large signal voltage gain (a v ) 5. common-mode rejection ration (cmrr) 6. power supply rejection ratio (psrr) figure 24. test circuit 1 (one channel only) |v f8 - v f7 | cmrr = 20log ? v icm (1+r f /r s ) [db] a v = 20log |v f6 -v f5 | ? e k (1+r f /r s ) [db] psrr = 20log |v f10 -v f9 | ? vcc (1+ r f /r s ) [db] v io = 1 + r f / r s [v] |v f1 | i b = 2 x r i x (1 + r f / r s ) [a] |v f4 - v f3 | i io = r i x (1 + r f /r s ) [a] |v f2 - v f1 | v icm r s =50 ? r s =50 ? r f =50k ? r i =10k ? r i =10k ? sw1 sw2 50k ? sw3 r l 0.1 f e k 500k ? 500k ? 1000pf v f 0.1 f 15v -15v vcc vee vo v null dut downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 12/18 10.sep.2013 rev.001 tsz22111 ? 15 ? 001 ba15218f switch condition for test circuit 2 sw no. sw1 sw2 sw3 sw4 sw5 sw6 sw7 sw8 sw9 sw10 sw11 sw12 supply current off off off on off on off off off off off off maximum output voltage off off on off off off on off on off off on slew rate off off off on off off off on on on off off gain bandwidth off on off o ff on on off off on on on off input referred noise voltage on off off off on on off off off off on off figure 25. test circuit 2 (each channel) figure 26. slew rate input waveform figure 27. test circuit 3 (channel separation) vh vl input wave t input voltage vh vl t v output wave sr v/ t t output voltage 90% 10% sw1 sw2 sw3 sw10 sw11 -in +in r l vcc vee sw9 sw6 sw7 sw8 c l sw12 r s sw5 sw4 r1 r2 vcc vee r2=100k ? r1=1k ? vcc vee out1 =0.5vrms v in out2 r1//r2 r1//r2 r1=1k ? r2=100k ? out2 cs = 20log 100 out1 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 13/18 10.sep.2013 rev.001 tsz22111 ? 15 ? 001 ba15218f power dissipation power dissipation (total loss) indicates the power that the ic can consume at t a =25c (normal temperature). as the ic consumes power, it heats up, causing its temperature to be higher than the ambient temperature. the allowable temperature that the ic can accept is limited. this depends on the circuit configuration, manufacturing process, and consumable power. power dissipation is determined by the allowable temperature within the ic (maximum junction temperature) and t he thermal resistance of the package used (heat dissipation capabilit y). maximum junction temperature is typically equal to the maximum storage temperature. the heat generated through the cons umption of power by the ic radiates from the mold resin or lead frame of the package. thermal resistance, represented by the symbol ja c/w, indicates this heat dissipation capability. similarly, the temperature of an ic inside its package can be estimated by thermal resistance. figure 28(a) shows the model of the thermal resistance of the package. the equation below shows how to compute for t he thermal resistance ( ja ), given the ambient temperature (t a ), junction temperature (t jmax ), and power dissipation (p d ). ja = (t jmax t a ) / p d c/w the derating curve in figure 28(b) indicates the power that t he ic can consume with reference to ambient temperature. power consumption of the ic begins to attenuate at certain temperatures. this gradient is determined by thermal resistance ( ja ), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. this may also vary even when the same of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figure 28(c) shows an example of the derating curve for ba15218f. 5.5 mw/c when using the unit above t a =25c, subtract the value abov e per celsius degree. permissible dissipation is the value when fr4 glass epoxy board 70mm 70mm 1.6mm (copper foil area less than 3%) is mounted. (c)ba15218f figure 28. thermal resistance and derating curve ja = ( t j max - t a )/ p d c /w a mbient temperature t a [ c ] chip surface temperature t j [ c ] (a) thermal resistance (b) derating curve 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] ba15218f 0 a mbient temperature t a [ ? c] p2 p1 25 125 75 100 50 power dissipation of lsi [w] p dma x t jma x ja2 ja1 ja2 < ja1 power dissipation of ic downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 14/18 10.sep.2013 rev.001 tsz22111 ? 15 ? 001 ba15218f examples of circuit voltage follower inverting amplifier non-inverting amplifier figure 30. inverting amplifie r circuit figure 31. non-inverting amplifie r circuit figure 29. voltage follower circuit voltage gain is 0db. using this circuit, the output voltage (out) is configured to be equal to the input voltage (in). this circuit also stabilizes the output voltage (out) due to high input impedance and low output impedance. computation for output voltage (out) is shown below. out=in for inverting amplifier, input voltage (in) is amplified by a voltage gain and depends on the ratio of r1 and r2. the out-of-phase output voltage is shown in the next expression out=-(r2/r1) ? in this circuit has input impedance equal to r1. for non-inverting amplifier, input voltage (in) is amplified by a voltage gain, which depends on the ratio of r1 and r2. the output voltage (out) is in-phase with the input voltage (in) and is shown in the next expression. out=(1 + r2/r1) ? in effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. out vee in vcc r2 r1 vee in out vcc r1//r2 vee r2 vcc in out r1 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 15/18 10.sep.2013 rev.001 tsz22111 ? 15 ? 001 ba15218f operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and s upply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the p d stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the p d rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground t he ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure 32): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction op erates as a parasitic transistor. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 16/18 10.sep.2013 rev.001 tsz22111 ? 15 ? 001 ba15218f operational notes C continued parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 32. example of monolithic ic structure 12. unused circuits when there are unused op-amps, it is recommended that they are connected as in figure 33, setting the non-inverting input terminal to a potential within the in-phase input voltage range (v icm ). 13. input voltage applying vee +36v to the input term inal is possible without causing deterioration of the electrical char acteristics or destruction, regardless of the supply voltage. however, this does not ensure normal circuit operation. please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 14. power supply(single/dual) the op-amp operates when the voltage supplied is between vcc and vee. therefore, the sing le supply op-amp can be used as dual supply op-amp as well. 15. output capacitor if a large capacitor is connected between the output pin and vee pin, current from the charged capacitor will flow into the output pin and may destroy the ic when the vcc pin is s horted to ground or pulled down to 0v. use a capacitor smaller than 0.1uf between output pin and vee pin. 16. oscillation by output capacitor please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop circuit with these ics. 17. short-circuit of output terminal when output terminal and vcc or vee terminal are shor ted, excessive output curr ent may flow under some conditions, and heating may destroy ic. it is necessary to connect a resistor as shown in figure 34, thereby protecting against load shorting. vdd keep this potential in vicm v icm - + vss figure 33. example of application circuit for unused op-amp protection resistor vee vcc figure 34. the example of output short protection downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 17/18 10.sep.2013 rev.001 tsz22111 ? 15 ? 001 ba15218f physical dimensions tape and reel information package name sop8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr)) downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200050-1-2 ?2013 rohm co., ltd. all rights reserved. 18/18 10.sep.2013 rev.001 tsz22111 ? 15 ? 001 ba15218f marking diagrams product name package type marking ba15218f sop8 15218 land pattern data all dimensions in mm pkg land pitch e land space mie land length R ? 2 land width b2 sop8 1.27 4.60 1.10 0.76 revision history date revision changes 10.sep.2013 001 new release sop8(top view) part number marking lot number 1pin mark sop8 mie ? 2 b 2 e downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

▲Up To Search▲

Price & Availability of BA15218F-E2

	To Download BA15218F-E2 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .